electronic packaging

Descripción del producto

Baienwei AlSi alloys include:Silicon content: *7%,*2%,*0%,*0% and *0%, mainly used in electronic packaging field. AlSi alloy can be used in substrates,housings,carriers and lids, having a better compatibility and heat dissipation to prolong the working life of high power modules. AlSi alloys have the features such as light weight,(density 2.4—2.7g/cm³),high thermal conductivity,low CTE,high stiffness,excellent machinability,weldability,surface plating performance,hermeticity,high temperature resistance and corrosion resistance etc.
 Baienwei adopts rapid solidification and subsequent machining technology, offering a series of electronic packaging services,including R&D,production,subsequent machining and plating.