Descripción del producto

AL base thermal conductive CCL provides the advantages of high thermal conductivity, Excellent solder heat endurance, Excellent Breakdown Voltage, reliability, Thermal conductivity is about five-ten times higher than the FR*4, PCB produced by the subtract can transfer heat, which is electronic components generate, throughing the substrate structure rapid conduct to the back-end cooling base or other cooling modules. Aluminum Copper Clad Laminate Sheet is a sandwich structure, which includes layers of conductor, insulator and metal base. In general, this insulator is made of epoxy resin and high thermal Conductivity filler. The products have been through a number of demanding for a long time environmental testing, access to international certification. 
The Thermal conductivity is 1.**3.0W/M. K, It can fit the demand of high end and MID-range products, with high cost performance. All products pass RoHS standard, have good property and meet low-carbon environmental trend.