caramics sputtering target

Descripción del producto

1.) Oxide sputtering target: La2O3, CeO2, Nd2O3, Sm2O3, Eu2O3, Gd2O3, Tb4O7, Dy2O3, Ho2O3, Er2O3, Tm2O3, Yb2O3, Lu2O3, Sc2O3, Y2O3, Ta2O5, Nb2O5, Ga2O3, V2O5, ZrO2 doped with Ti, WO3, HfO2, MgO, Al2O3, Indium Tin Oxide, ITO (In2O*-SnO2), ZnO, Al2O3 doped ZnO (AZO), Ga2O3 doped ZnO (GZO), La0.*7Sr0.*3MnO3 (LSMO), ZrO*-Y2O3 stabilized (YSZ), ZrO2+Ti, ZrO2+SiO2, Bi2O3, Cr2O3, MoO, MoO3, NiO, SiO, Cr-SiO, SiO2, TiO, TiO2, TiO*-Nb2O5, Ti2O3, Ti3O5, CuO/Al2O3, Sb2O3, BaO, BaTiO3, CaO, Fe2O3, Fe3O4, PbO, PbTiO3, PbZrO3, LiNbO3, SrO, SrTiO3, SrZrO3, SrBaTiO3, PZT (Plumbum Zirconate Titanate), SrRuO3, LaNiO3, InGaZnO, CuInO2. 2.) (Boride, Carbide, Nitride, Fluoride, Silicide, Sulfide) sputtering target LaB6, ZrB2, CrB2, TiB2, HfB2, Mo2B5, TaB2, NbB2, W2B, WB, VB2 TiC, SiC, WC, WC-Co, B4C, TaC, ZrC, Cr3C2, HfC, Mo2C, VC LaN, CeN, PrN, NdN, SmN, EuN, GdN, TbN, DyN, HoN, ErN, TmN, YbN, LuN, ScN, YN, Si3N4, AlN, BN, BN/SiC mixture, HfN, TaN, NbN, ZrN, TiN, VN LaF3, CeF3, NdF3, YF3, NaF, KF, BaF2, AlF3, LiF, CaF2, SrF3, SrF2, MgF2 CoSi2, Mo5Si3, MoSi2, Ta5Si3, TaSi2, Nb5Si3, NbSi2, CrSi2, Cr3Si, HfSi2, TiSi2, Ti5Si3, ZrSi2, WSi2, VSi2, V3Si, NiSi, CdS, ZnS, ZnS:Mn, In2S3, Sb2S3, PbS, MoS2, TaS2, WS2 3.) Metal sputtering target: Gold, Au, Silver, Ag, Osmium, Os, Platinum, Pt, Palladium, Pd, Iridium, Ir, Ruthenium, Ru, Rhenium, Re, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sc, Y, Silicon, Si, Tellurium, Te, Bismuth, Bi, Tin, Sn, Zinc, Zn, Sulphur, S, Graphite, C, Boron, B, Lead, Pb, Antimony, Sb, Selenium, Se, Chromium, Cr, Cobalt, Co, Aluminum, Al, Nickel, Ni, Titanium, Ti, Tungsten, W, Molybdenum, Mo, Tantalum, Ta, Niobium, Nb, Zirconium, Zr, Hafnium, Hf, Vanadium, V, Germanium, Ge, Indium In, Copper, Cu, Iron, Fe, Manganese, Mn, , Magnesium, Mg, Barium, Ba, Cadmium, Cd, Calcium, Ca, Strontium, Sr. 4.) Alloy sputtering target: NiYb, Ni2Yb, Ni3Yb, Ni-Yb, LaNi, La-Ni, Co-Ni, V-Ni, Cr-Ni, Ti-Ni, Fe-Ni, Co-Ni-Cr, Ni-Zr-Y, Ni-Gd-Ce, Co-Cr-Ta, Ho-Cu,