Descripción del producto

• High quality heating material produces high temperature breezing, precise controlling BGA soldering and desoldering.
• Movable heating head can move to all directions for easy operation.
• Upper/lower hot air, set up accurate temperature controlling with bottom IR constant temperature heating zone and reasonable temperature-controlling system ensuring safe reparation.
• Upper hot air 8 segments temperature up(down) + 8 segments constant temperature control with *0 groups temperature setting savable. Lower hot air 8 segments temperature up(down) + 8 segments constant temperature control with *0 groups temperature setting savable and computer communication function is provided.
• BGA soldering zone supporting frame can be fine adjusted the height to prevents the depression of soldering area.
• Multi-function PCB fixing frame locates PCB quickly and conveniently as well as suitable for ­­­irregular shape board.  
• Powerful cross flow fan cools down lower heating zone instantly.
• Beep alarming function when soldering or unsoldering finished. Hand vacuum suck pen picks away BGA easily.
• Equipped with over temperature alarming and protection function for both upper and lower heating zone.
• Equipped with a couple of different sizes alloy nozzles that are easy to be replaced and can be customized based on practical needs.
• Laser positioning setup makes fixing PCB more quickly and convenient.          
• Solid status working can be displayed that secures safe temperature controlling.