BERGQUIST GAP FILLER 3500S35

Descripción del producto

BERGQUIST GAP FILLER TGF ***0 Known as BERGQUIST GAP FILLER ***0S*5

BERGQUIST GAP FILLER TGF ***0 is the technology leader in thermally conductive,liquid gap filling mate-rials,featuring ultra-high thermal performance and superior softness.The material is two-component,cured either at room or elevated temperature.Prior to curing,the material

maintains good thixotropic characteristics as well as low viscosity.The result is a gel-like

liquid material designed to fill air gaps and voids yet flow when acted upon by an

external force (e.g.dispensing or assembly process).The material is an excellent solution

for interfacing fragile components with high topography and/or stack-up tolerances to a

universal heat sink or housing.Once cured,it remains a low modulus elastomer designed

to assist in relieving CTE stresses during ther-mal cycling yet maintain enough modulus to

prevent pump-out from the interface.Bergquist Gap Filler ***0S*5 will lightly adhere to surfaces,thus improving surface area contact.Bergquist GF***0S*5  is not designed to be a

structural adhesive.