Precio FOB
Obtener el precio más reciente( Negotiable )
|20 Piece Minimum Order
País:
Japan
N º de Modelo:
MFS05-1-063
Precio FOB:
( Negotiable ) Obtener el precio más reciente
Lugar de origen:
China
Precio de pedido mínimo:
-
Cantidad de pedido mínimo:
20 Piece
Detalle de embalaje:
Carton
El tiempo de entrega:
21 days to 35 days
Capacidad de suministro:
200000 Piece per Year
Tipo de pago:
T/T
Grupo de productos :
Persona de contacto Gavin
Completely self-developed MEMS Hot-film silicon chip featured with
compactness, high accuracy, short response time & reverse flow
detection
Our unique design air intakes featured with more stable intake air
flow and more accurate measurement
Intelligent signal processing circuit;PCB design;All the devices is
mounted by SMT with reliable performance.
Aluminium wire bonding, advanced automatic aluminium wire bonding
equipment, featured with reliable performance and good
uniformity.
Gel casting technology make the circuit component be protected
against moisture, shock, which offers greater reliability.
Encapsulation materials is made of PBTGF*0, featured with following
advantages:high mechanical strength;resistance to press;high heat
resistance.
| País: | Japan |
| N º de Modelo: | MFS05-1-063 |
| Precio FOB: | ( Negotiable ) Obtener el precio más reciente |
| Lugar de origen: | China |
| Precio de pedido mínimo: | - |
| Cantidad de pedido mínimo: | 20 Piece |
| Detalle de embalaje: | Carton |
| El tiempo de entrega: | 21 days to 35 days |
| Capacidad de suministro: | 200000 Piece per Year |
| Tipo de pago: | T/T |
| Grupo de productos : | Air Flow Sensor |
